Fabrication of Aluminum Nitride-magnesium Oxide-magnesium Aluminum Oxide Ceramic Composite by Spontaneous Reactive Infiltration

Aluminum nitride ceramics are in high demand in electronic industries as substrate materials for applications requiring high thermal conductivity. Sintering and hot pressing are the most common processing methods used to make dense AlN ceramics. However, all methods of AlN sintering involve high temperatures and long times. Therefore, it is an expensive material. Removing oxygen, as a main impurity of aluminum nitride, by a low cost method in order to achieve dense and high thermal conductivity aluminum nitride ceramics has been pursued for many years.