Evaluation Findings of Bondade CU-31 Bonding Solution

Evaluation Findings of Bondade CU-31 Bonding Solution

Technical Evaluation Report

by Highway Innovative Technology Evaluation Center (U.S.)

58 pages· 1998· ISBN 9780784474471
About
Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center. The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The reportØdescribes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.

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