Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

by Erdogan Madenci

Book 719 of The Springer International Series in Engineering and Computer Science --

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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

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