G. S. Mathad

• Copper Interconnects, New Contact Metal- Lurgies, & Low-k Dielectrics
• Copper Interconnects, New Contact Metallurgies, Structures, and Low-k Interlevel Dielectrics
• Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II
• Highly Selective Dry Etching and Damage Control (Advances in Soil Science)
• Interconnect and contact metallization for ULSI
• Plasma etching processes for sub-quarter micron devices
• Plasma Processing XII
• Proceedings of the symposia on reliability of semiconductor devices/interconnections and dielectric breakdown, and laser process for microelectronic applications
• Proceedings of the Tenth Symposium on Plasma Processing
• Thin film materials, processes and reliability
• Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics
• Pattern Transfer in Integrated Circuit Fabrication