Tai-Ran Hsu

• MEMS and Microsystems
• MEMS packaging
• Mems Packaging (Emis Processing)
• Applied Engineering Analysis
• Computer Aided Design
• Computer-aided design
• The finite element method in thermomechanics
• Advances in Electronic Packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, Interpack '95
• Finite element analysis by microcomputers